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                产品生产

                时间:2016-10-25     作者:cc


                多样小量化代工服务

                Bringing designs to life

                ISO9001/2008认证的工艺流╱程,成本模型以及完善的ERP系统,使我们可以灵活高效并且低成本地支持多品种小批▂量的代工服务。多品种小批量的代工服务为我们多样化的产品提供支持,同时也↘极好地满足了分散型的客户对产品交付,质量以及客制化的不∑同需求。


                我们对员工进行严格地培训,以满足贴片,过孔,检验测试环节的不同专业需求。致力于保证持续稳定的高品质生产,无々论是小到数十件的小批量项目,还是上千片的规模化项目◥。

                SMT产线

                丝印机:

                • 内置模具清洁膏及双1/2D目检功能的全自动化的╱EKRA丝印机

                Pick and Place插针机:

                • Samsung SM411插针机

                  • 2 portals with 6 heads each

                  • nominal loading capacity of up to 42,000 CPH per IPC 8950

                  • + / - 50 microns at 3 sigma (chip)

                • Samsung SM421 插针机,

                  • 6 heads each

                  • nominal loading capacity of up to 21,000 CPH per IPC 8950

                  • + / - 50 microns at 3 sigma (chip) and + / - 30 microns at 3 sigma (QFP)

                • Intelligent feeders and Samsung EasyOLP line management

                汽相回流焊◆系统:

                • 2 ASSCON VP-2000 double-track line soldering for lead-free solder (230 °C medium)

                • 1 ASSCON VP-56 batch soldering system configured for leaded solder (200 °C medium)

                • 1 ASSCON VP-53 batch soldering system configured for lead-free solder (230 °C medium)

                自动光学检测→试备(AOI):

                • Viscom inspection systems with 1 orthogonal and 4 oblique cameras

                • ? 每个焊点均进行锡膏印刷检查,短路,冷焊点,立碑,反极及偏移检测

                X光检测:

                • Phoenix Microme x光机,于2010年投入使用

                • 我们产线中抽检1% 的硬件做X光检测,以识别missing of fillets, pores and voids, solder及icicling

                • Maximum inspection area of 610 x 560 mm, detail detectability of<1μ, and maximum tube voltage of 180 kV / 20 W

                • Automatic calculation of pore structures for multichip

                • Oblique 0 °C - 70 °C, rotation 0 °C - 360 °C

                THT产线

                波动焊接:

                • 带喷涂装置的波动焊接机(ERSA EWS-330)

                • System configured for conventional leaded solder

                • System with nitrogen and titanium pot cover configured for lead-free SAC solder

                • ZipaTec Select 250 selective solder pot changes for conventional solder and lead-free SAC solder

                产品测试

                • 边界扫描测试系统

                • 专利功能测试框架

                质量管理

                内部质量管理项目实施于原材料,劳动用工及生产的每个环节。我们通过的认证及标准包括:

                • ISO9001:2008

                • 100% Traceability

                • RoHS-compliance

                • REACH

                • WEEE

                • IPC-600A-F class 2, 3 PCBsv

                • IPC-610A-D class 2 assembly

                • No-Clean processes per J-STD-004 standards.

                • VDA, KTA140